Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package

Thermomechanical stress generation on a silicon chip in an embedded-die package (EDP) was investigated. Change thermomechanical the with temperature evaluated using piezo-resistance gauges fabricated chip. To investigate impact of redistribution layer (RDL) generation, EDP where filling materials facing top and bottom sides periphery embedded die were entirely removed fabricated. The removal carried out by CO2 laser ablation technology. RDL having diagonal paths from substrate to designed addition conventional orthogonal RDL. RDLs made copper. Temperature tests range 260 degrees C 100 C. experimental results indicate that, while origin is mismatch coefficients thermal expansion (CTE) between organic substrate, plays significant role generating also show that design effectively reduces owing its spring characteristic.